Packaging Design & Manufacture of High Temperature Electronics Module for 225oC Applications utilizing Hybrid Microelectronics Technology

Many downhole instrumentation tools manufacture today utilizing organic material packaging technology for producing electronic modules. Such approach with organic PCB, standard packaged discrete semiconductor and SMT-type passive components has limited the device operating temperature range in 177oC area. An alternative packaging approach is to utilize Hybrid Microelectronics Technology to increase the operating temperature limit up to 225oC in production environment. Besides performance improvements on upper operating temperature limit, thermal cycling, high frequency shock and vibration, based on our customer’s reliability testing data, hermetically sealed high-temperature Hybrid module’s survivability can exceed over 7000 hours of MTTF at 225oC high temperature storage condition along with other environmental matrix testing. Moreover, comparing with high-temperature SMT and Thru-hole Technologies, Hybrid Microcircuit increases packaging density and provides valuable real estate saving. Vectron International has successfully utilized Hybrid Technology to manufacture thousands of hitemperature electronic module for 200oC to 225oC applications. This paper describes the packaging design of a 225oC hi-temp electronic module for down-hole application using such technology. This paper will also touch bases on material selection, fabrication technique and some reliability data of this hightemperature Hybrid module.